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| OEM | OEM Services Provided |
| Feature | Good stability |
| Classification | Paint Additives |
| Advantage | Professional, Fast Delivery, Customizable | Samples | Apply for free，Contact Export Director now ↓ |
We also offer phenolic resins as a hardening agent for the electronic industry. They offer good mechanical strength, dimensional/thermal stability, and resistance to electricity, solvent, and acid. They are widely used in molding materials (including electronic packaging materials), laminate materials, and impregnation.
| Category | Details |
|---|---|
| Key Applications | – Copper-Clad Laminates (CCL): High-frequency PCBs – Packaging: Food cans, beverage cartons – Composites: Friction materials, brake pads – Molding: Electrical insulators |
| Material Advantages | – Thermal Stability: Tg >180°C – Electrical Insulation: Dielectric strength >40kV/mm – Adhesion Strength: >1,500psi peel strength – Flame Retardancy: UL94 V-0 rating |
| Processing Features | – Curing Temperature: 160-180°C – Flow Characteristics: Low viscosity for complex molds – Fillers Compatibility: Glass fibers, mineral powders – Cycle Time: <30 min for compression molding |
| Eco-Compliance | – VOC Emissions: <0.5% (water-based systems) – Heavy Metals: Pb, Cd, Hg, Cr(VI) free – Recyclability: >90% recovery rate – Certifications: REACH, RoHS, FDA food contact compliant |
| Market Differentiation | – High-Frequency CCL: Low Dk/Df for 5G infrastructure – Sustainable Packaging: Replace epoxy in green applications – Automotive: High-temperature resistance under hood |
| Quality Parameters | – Residual Monomer: <0.1% (GC-MS) – Moisture Content: <0.3% (Karl Fischer) – Color Consistency: ΔE <1.5 (CIE Lab) |
| Industry Trends | – Miniaturization: Thinner dielectrics for advanced electronics – Circular Economy: Recycled resin systems – Regulatory Pressures: Increasing focus on life cycle assessments |
Note: Balancing performance and sustainability. Emerging as critical material in high-speed digital applications and eco-conscious packaging solutions.
| Property | Value Range |
|---|---|
| Glass Transition Temp (Tg) | 120-180°C |
| Thermal Decomposition | >300°C |
| Dielectric Constant (1MHz) | 4.0-5.0 |
| Flexural Strength | 80-120 MPa |
| Water Absorption | 0.1-0.5% |
| Characteristic | Phenolic Resin | Epoxy Resin | Polyimide |
|---|---|---|---|
| Cost Efficiency | ★★★★★ | ★★★☆ | ★★☆ |
| Thermal Resistance | ★★★★ | ★★★ | ★★★★★ |
| Processability | ★★★★ | ★★★★★ | ★★★ |
| Moisture Resistance | ★★★ | ★★★★ | ★★★★★ |
| Parameter | Typical Value |
|---|---|
| Curing Temperature | 150-180°C |
| Curing Time | 30-90 min |
| Pressure | 10-30 kgf/cm² |
| Resin Content | 30-50% |
Phenolic resins remain a cost-effective solution for CCL and electronic packaging applications, offering balanced thermal and mechanical properties. While newer materials offer superior performance in specific areas, phenolic resins continue to dominate many standard applications due to their proven reliability and favorable cost-performance ratio.
Declaration: The products displayed on this website are intended exclusively for industrial applications or scientific research. They are not intended for medical, pharmaceutical, or food use. In accordance with applicable laws and regulations, purchasing organizations must hold valid qualifications and approvals.
For help with solutions customized to your business needs, contact Export Director now.
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