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| OEM | OEM Services Provided |
| Feature | Good stability |
| Classification | Paint Additives |
| Advantage | Professional, Fast Delivery, Customizable | Samples | Apply for free，Contact Export Director now ↓ |
We also offer phenolic resins as a hardening agent for the electronic industry. They offer good mechanical strength, dimensional/thermal stability, and resistance to electricity, solvent, and acid. They are widely used in molding materials (including electronic packaging materials), laminate materials, and impregnation.
Table 1: Types of Phenolic Resins Used in CCL & Packaging
| Type | Characteristics | Applications |
|---|---|---|
| Novolac Resin | Thermoplastic, requires curing agent (hexamine) | Copper Clad Laminates (CCL), PCB substrates |
| Resole Resin | Thermosetting, self-curing at high temperature | Packaging materials, adhesives, coatings |
| Brominated Resin | Flame-retardant, high thermal stability | High-performance CCL, electronic packaging |
Table 2: Key Properties of Phenolic Resins for CCL & Packaging
| Property | Value/Description | Importance |
|---|---|---|
| Thermal Stability | Up to 300°C (depending on formulation) | Ensures reliability in high-temperature applications |
| Flame Resistance | UL94 V-0 rating (brominated types) | Critical for PCB and packaging safety |
| Dielectric Strength | 10–15 kV/mm | Essential for CCL in high-frequency PCBs |
| Moisture Resistance | Low water absorption (<1%) | Prevents delamination in PCBs & packaging |
Table 3: Comparison with Alternative Resins
| Resin Type | Advantages | Disadvantages |
|---|---|---|
| Phenolic Resin | Low cost, high heat resistance | Brittleness, limited flexibility |
| Epoxy Resin | Better adhesion, flexibility | Higher cost, lower thermal stability |
| Polyimide Resin | Excellent thermal & chemical resistance | Very high cost, processing complexity |
Table 4: Market Applications
| Industry | Use Case | Phenolic Resin Role |
|---|---|---|
| Electronics | PCB substrates, CCL | Provides insulation & mechanical support |
| Packaging | Molding compounds, coatings | Enhances durability & flame resistance |
| Automotive | High-temperature components | Withstands thermal stress |
Phenolic resins remain a cost-effective solution for CCL and packaging, offering excellent thermal and flame-resistant properties. While alternatives like epoxy and polyimide exist, phenolic resins dominate in applications requiring high performance at lower costs.
Declaration: The products displayed on this website are intended exclusively for industrial applications or scientific research. They are not intended for medical, pharmaceutical, or food use. In accordance with applicable laws and regulations, purchasing organizations must hold valid qualifications and approvals.
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