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ELECTRONIC GRADE STRIPPER

OEM  OEM Services Provided
Feature Good stability
Classification Paint Additives
Advantage  Professional, Fast Delivery, Customizable
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Stripper for TFT-LCD. When used in the TFT-LCD process, Stripper will be heated before immersing the glass substrate, and then Rinse with solvent to remove water. The main function of Stripper is to remove the excess photoresist after the line etching is completed.

CategoryDetails
Primary FunctionRemoval of photoresist, solder masks, conformal coatings
Key Applications– PCB Manufacturing: Post-etch cleaning
– Semiconductor: Wafer photoresist stripping
– Advanced Packaging: Underfill removal
– Rework: Component debonding
Technical Features– Stripping Speed: <2 min @40°C
– Residue Limit: <10μg/cm² (ion chromatography)
– Material Compatibility: Copper, gold, epoxy
– Flash Point: >93°C (non-flammable)
Safety Profile– Toxicity: Non-carcinogenic (no DMAc/NMP)
– Corrosivity: pH 7-9 (neutral formulation)
– PPE Requirements: Chemical-resistant gloves, goggles
– Storage: 5-30°C, away from oxidizers
Environmental Impact– VOC Content: <1% (water-based)
– Waste Disposal: Neutralization followed by biological treatment
– Eco-Certifications: RoHS, WEEE compliant
– Carbon Footprint: Reduced packaging (recycled HDPE containers)
Formulation Options– Customizable Viscosity: 50-500cPs
– Additives: Corrosion inhibitors, wetting agents
– Packaging: 1L-200L drums with nitrogen blanket
Market Trends– Growth Drivers: Miniaturization of electronics, 5G infrastructure
– Regulatory Pressures: REACH, TSCA compliance
– Sustainability: Transition to bio-based solvents
Quality Standards– Particle Count: <100 particles/mL (>0.5μm)
– Metal Ion Content: <1ppb (ICP-MS analysis)
– Shelf Life: 24 months from production date

Note: Critical for high-precision electronic assembly. Advanced formulations enable selective stripping without damaging delicate substrates.

Performance Requirements

ParameterElectronic GradeIndustrial Grade
Purity≥99.999%≥99%
Metal Impurities≤0.1 ppb≤10 ppm
Particle Count≤5 particles/mLNot controlled
Water Content≤5 ppm≤1000 ppm

Common Chemical Compositions

TypeActive IngredientsBest For
Solvent-BasedDMSO, NMP, glycol ethersThick photoresist removal
AlkalineTMAH, KOH solutionsPositive tone resists
AcidicSulfuric acid/hydrogen peroxidePost-etch cleaning
Semi-AqueousHydroxylamine mixturesIon-free residue removal

Applications in Electronics

Usage in Semiconductor Processes

Manufacturing StepFunctionTechnical Benefit
PhotolithographyResist strippingPattern fidelity preservation
Etch ProcessesPost-etch cleaningMetal ion contamination control
Wafer BondingSurface preparationImproved adhesion
PackagingFlux residue removalReliability enhancement

 

Declaration: The products displayed on this website are intended exclusively for industrial applications or scientific research. They are not intended for medical, pharmaceutical, or food use. In accordance with applicable laws and regulations, purchasing organizations must hold valid qualifications and approvals.

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