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| OEM | OEM Services Provided |
| Feature | Good stability |
| Classification | Paint Additives |
| Advantage | Professional, Fast Delivery, Customizable | Samples | Apply for free，Contact Export Director now ↓ |
Semiconductor mold cleaners MC-261 and MC-701 are thermosetting resins formed by mixing melamine resin with organic and inorganic fillers. Our mold cleaners yield good results in removing residuals left on the mold after molding with epoxy resin materials. Due to the molding conditions are the same as epoxy resin, they are easy to operate and can save time and effort.
Mold Cleaner for Semiconductor: Overview and Key Properties
| Category | Details |
|---|---|
| Chemical Type | Specialized solvent blend (semi-aqueous or solvent-based) |
| Purpose | Remove mold release agents, residues, and particles |
| Compatibility | Safe for epoxy, metal, and ceramic molds |
| Form | Liquid, aerosol, or gel |
Key Performance Properties
| Property | Specification |
|---|---|
| Cleaning Efficiency | >99% residue removal |
| Drying Time | <5 min (room temp) |
| Surface Tension | <30 dynes/cm |
| Non-Volatile Content | <50 ppm |
| Particle Count | <10 particles/mL (>0.1 µm) |
Formulation Components
| Component | Function | Content (%) |
|---|---|---|
| Solvents | Residue dissolution | 60-90 |
| Surfactants | Particle suspension | 5-15 |
| Corrosion Inhibitors | Metal protection | 1-5 |
| Chelating Agents | Ionic contamination control | 0.5-3 |
Cleaning Process Parameters
| Parameter | Optimal Range |
|---|---|
| Temperature | 20-50°C |
| Ultrasonic Frequency | 40-80 kHz |
| Contact Time | 1-10 min |
| Rinse | DI water or solvent |
Applications
| Process Stage | Target Contaminants | Equipment Compatibility |
|---|---|---|
| Post-Molding | Epoxy bleed, release agents | Transfer molds |
| Pre-Assembly | Handling residues | Lead frames |
| Maintenance | Carbon deposits | Ejector pins |
Comparison with Alternatives
| Feature | Semiconductor Mold Cleaner | General Degreaser | Plasma Cleaning |
|---|---|---|---|
| Particle Control | Ultra-low (<10) | High (>1000) | None |
| Material Safety | Non-damaging | May attack polymers | Thermal risk |
| Throughput | High (batch processing) | Medium | Low |
Safety & Compliance
| Parameter | Standard |
|---|---|
| VOC Content | <300 g/L (EPA Method 24) |
| SEMI Compliance | SEMI F72-0708 |
| Storage | 12 months @ 15-25°C |
Market Data
| Segment | Market Share | Growth (CAGR) |
|---|---|---|
| Packaging | 45% | 6.2% |
| Foundry | 35% | 5.8% |
| OSAT | 20% | 7.1% |
Key Advantages and Limitations
| Advantages | Limitations |
|---|---|
| Precision contamination control | Higher cost vs industrial cleaners |
| Zero mold damage | Requires optimized process parameters |
| Compatible with sensitive materials | Special disposal requirements |
Summary
Semiconductor-grade mold cleaners deliver unmatched precision for advanced packaging, combining ultra-clean performance with material safety. Their optimized formulations address the industry’s escalating demands for yield and reliability in heterogeneous integration.
Declaration: The products displayed on this website are intended exclusively for industrial applications or scientific research. They are not intended for medical, pharmaceutical, or food use. In accordance with applicable laws and regulations, purchasing organizations must hold valid qualifications and approvals.
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